The main products include KOKI welding materials, Zymet glue, cleaning agent.
Alloy Code | Characteristic | Sn | Ag | Cu | In | Bi | Ni | Co | Melting point (o C) | Powder diameter | Particle size（ μ M) |
S3X | Standard Edition | Reminder | 3.0 | 0.5 | 217-220 | Type3 Type4 Type5 Type6 | 20-45μm 20-38μm 10-25μm 5-20μm | ||||
SB6N | High reliability | Reminder | 3.5 | 6.0 | 0.5 | 202-210 | |||||
TB | Low-melting | Reminder | 58 | 138 | Type3 Type4 | 20-45μm 20-38μm | |||||
TAB | 1 | 57 | 138-140 | ||||||||
T4AB | 0.4 | 57.6 | 138-140 | ||||||||
S01XBIG | Low silver, anti-corrosion | Reminder | 0.1 | 0.7 | 1.6 | + | 211-227 | ||||
S1XBIG | 1.1 | 0.7 | 1.8 | + | 211-223 |
Types | Model | Characteristic |
Halogen-free | S3X48/58-M500 series | ? Stable printing of 0.4QFP and 0.30 φ CSP ? Ensure good 0.4QFP and 0.30 φ， 0603 Component wettability ? Halogen free solder paste (Cl+Br:<1500ppm) ? Reduced occurrence of air bubbles through the use of new additives ? Improve heat resistance to prevent the incidence of defective pillows ? Achieve continuous printing and reduce solder paste waste |
| Halogen-free | S3X58-M650 series | ? Completely halogen-free: BS EN14582 (F, Cl, Br, I=0ppm) ? Special flux developed for good ICT testability ? Carefully selected flux composition can achieve excellent low bubble effect ? Complete melting and perfect wetting ? On the Micro Pad(<0.4mm pitch)And small parts(<0.25mm dia. CSP, 0603 chip) |
Double-sided process | S3X58-A340 | ? Ensure that the micro solder pads (0603 components, 0.25mm φ Good solubility of CSP ? Capable of maintaining initial printability after a 30 minute interruption ? It can maintain printability even after 200 consecutive rolls ? Possesses the most suitable rosin composition for double-sided mounting, and has good component adhesion |
High reliability | SB6N/X58-M500SI SB6N58-A730-3 | ? The indium content helps the solder alloy resist thermal stress and prevent cracks in the solder joint ? Low thermal deformation, maintaining reliability in harsh application environments ? Ultra-fine pitch (0.4mm/16mil) and CSP (>0.3mm in diameter), ensuring excellent continuous printing capability, suitable for normal to fast printing (20 ~ 80mm/sec) and long stencil idle time ? Halogen-free standard (Cl+Br: 0ppm) BS EN14582 |
Low cost and high reliability | S01XBIG58-M500-4/B S1XBIG58-M500-4/B | ? Low-silver alloys are more reliable than traditional low-silver alloys ? Perfect melting and wetting of ultra-fine pitch microcomponent dia (> 0.25mm. CSP, 0603Chip) ? Low melting point can be used in normal reflow oven temperature of SAC305 ? Halogen-free standard (Cl+Br = less than 1500ppm EN14582 |
Low-melting | TB/TAB/T4AB48/58-M742 | ? Low melting point (138 ℃), complete melting and perfect wetting ? Ultra fine pitch (<0.4mm pitch), micro components (>0.3mm, dia. CSP, 0603 chip) |
Spot tin | S3X811-E150DN | ? Solder paste designed specifically for jet dispensing ? Compatible with multiple spray heads, precisely control the spray volume of each point ? Halogen free (Br+Cl:<1500ppm) BS EN14582 |
Address：Room 804, No. 200. Xinghai Rd, Suzhou City, Jiangsu Frovince, China
Phone：0512-62567570
0512-62567686
Email：solder@dingshengsz.com
